BAE transitioning first set of multi-chip prototypes into EW systems under DoD’s SHIP program

BAE transitioning first set of multi-chip prototypes into EW systems under DoD’s SHIP program
BAE transitioning first set of multi-chip prototypes into EW systems under DoD’s SHIP program

With the delivery of the first set of prototypes, “the pendulum is swinging back to onshoring our own domestic capabilities,” Heidi Shyu, under secretary of defense for research and engineering, told reporters.

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DoD Seeks $2.3B To Bolster US Chip Making

DoD Seeks $2.3B To Bolster US Chip Making
DoD Seeks $2.3B To Bolster US Chip Making

“From the DoD’s perspective, they’re highly dependent on [Asia] for fabrication and packaging [of chips],” Hudson Institute’s Bryan Clark tells Breaking Defense. This has led to DoD calls to address a “fragile and threatened” chip supply chain.

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